Process Services

  • Microfluidics, MEMS, bolometers, Biodevices, photonics, RF devices, complex thin films including organic thin films

  • Legacy Processing

Processing both 100mm (4-inch) and 150mm (6-inch) wafers and glass

Have access to a full fabrication facility that includs such tools as:

  • DRIE (Oxford, Alchatel and Chlorine Etching)

  • Full lithography facility

  • Thin Films: Sputtering, Reactive Sputtering, Evaporation, Organic Materials Evaporation, Pulsed Magnetron

  • Wafer Bonding

  • Nanoscribi Photonic 3D Printer (min feature 200nm)

  • Access to full Surface Science Suite